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CX-E100/E200 X-ray Intelligent Inspection Equipment

Used for detecting internal defects in devices such as PCB, PCBA, SMT assembly, IC, BGA, CSP, MEMS, flip-chip, LED chips, IGBT, FPC soft boards, electronic connectors, semiconductors, and in the electronic industry, as well as internal defects in new energy batteries.
BGA defects: voids, insufficient solder, bridging, misalignment, open circuits, solder splashes, cold solder joints, and pillow defects.
Defects in semiconductor products (such as ICs and IGBTs): bond wire detachments, collapsed lines, and necking defects.
New energy battery defects: layer count, voltage irregularities, ohmic resistance, and tilt angle defects.
Welding defects in new energy and automotive electronics FPC soft boards: pad misalignment, bubbles, etc.
Internal welding and assembly defects in products such as LEDs, electronic connectors, and fuses.

Functions:

90KV/130KV Closed Integrated X-ray Source, Long Lifespan, Maintenance-Free
Detector with 60° Tilt Angle for Rotational Inspection
CNC Automatic Programming Function
CCD Window Navigation for Testing Position
Rich Detection Tools: Distance, Angle, Polygon Area Definition, Solder (Bubbles) Area Statistics
Automatic Determination of Non-Conforming Products

Advantages:

Integrated AI Deep Learning Algorithms
Customizable Detection Content Development
Industry-Leading Image Enhancement
Self-Shielding Enclosure with Safety Interlock Mechanism, Real-Time Radiation Monitoring, Less Than 1 μSv/h

Specs: